Argotech a.s.

Pdf

R&D and packaging services in the field of MICROELECTRONICS and OPTOELECTRONICS

Business description

Packaging One Stop House focused for MICRO- & OPTO- electronic located in Czech Republic.
Team of 70+ experts with more than 20 years experience. Hybrid assembly from wafer to discreet component. Production scalability from 1 piece to 1kk in clean room 1 000 m2. Industry, space, security, medical and automotive markets experience. Silicon Photonics industrialisation partner.

Description of the offer

  • Packaging service of MICROELECTRONICS and OPTOELECTRONICS

Matchmaking information

  • Skills / Products / Services OFFERED
  • Active/adaptative optics
  • Fibre optics
  • Fibre-optic devices/systems
  • Laser system components and equipment
  • LED/OLED
  • Photonics sensors
  • Spectrometers
  • Imaging sensors
  • Sensors and imaging systems
  • Optoelectronic components and assemblies
  • Optomechanical components and assemblies
  • Services/councils

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Details

  • DIE ATTACH

Details

  • WIRE BONDING

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  • BUTT COUPLING APPROACH AND HYBRID INTEGRATION

Details

  • FREE SPACE OPTICS COUPLING