Finetech GmbH & Co. KG

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Finetech GmbH & Co. KG

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Business description

Finetech manufactures high-accuracy equipment for leading-edge sub-micron bonding and micro assembly challenges. Finetech's bonders are suitable to R&D, prototype and production environments. Solutions by Finetech are applied in various industries to support precise and complex applications: flip chip, laser bars, photonics packaging, VCSELs, MEMS, sensors, chip to wafer, and many more.

Description of the offer

  • die bonder
  • flip chip bonder
  • equipment
  • FINEPLACER®
  • FINEPLACER® femto 2
  • eutectic soldering
  • AuSn soldering
  • UV gluing

Matchmaking information

  • Participation objectives
  • Purchase/Sales
  • Prototyping/proof of concept/demonstrator
  • Small and middle serie production
  • Industrialization/Manufacturing
  • Rental of equipment
  • Skills / Products / Services OFFERED
  • Laser system components and equipment
  • UV technology
  • Imaging sensors
  • Machining and production equipment
  • Optoelectronic components and assemblies
  • Optomechanical components and assemblies
  • Quantum photonics

Supplier

Participants

RS avatar

Ralph SCHACHLER

Sales Manager

Key elements

  • Turnover : 10 - 50 M€
  • Staff : 100 - 250
  • Category : SME

Application field(s)

  • Photonics components and materials
  • Telecommunication and quantum information
  • Others

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